Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.

Fundamentals of Geometric Dimensioning and Tolerancing (GD&T) for the PWB Design Engineer

Speaker

Gary Ferrari

Duration
 3min 43sec

Millions of dollars’ worth of PWBs are scrapped each year due to tolerance errors in the final product. A good majority of these errors are due to incorrect tolerancing of holes, edges and other board features. This seminar will explain how GD&T can help you avoid high scrap rates and reduce overall cost due to improper dimensional tolerances. It will show how to apply GD&T to printed wiring boards without all the confusion found in complex mechanical objects such as gear trains and castings. The principles discussed follow the ASME Y14.5 standard, as well as IPC-2615, Printed Board Dimensions and Tolerances. Attendees will learn GD&T principles for printed wiring boards, appropriate symbology for drawings, and bilateral vs. geometric dimensioning.

Speaker  :  
Ata Syed
Company : 
PFC Flexible Circuits
Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers  Flex layer processing and stackup Polyimides...
Speaker  :  
Ata Syed
Company : 
PFC Flexible Circuits
The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits: What is flex? Why use flex? Who should know flex? When to use flex Where to use flex   Presenter Ata Syed is...
Speaker  :  
Ethan Pierce
Company : 
Pierce Design
Maintaining a product is very difficult when: The source files aren’t available Only Gerber files and maintenance documents are available Making a revision to a company-owned product with no...
Speaker  :  
Robert Carter
Company : 
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker  :  
Michael R. Creeden
Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker  :  
Daniel J. Smith
Company : 
Raytheon SAS
Skill Level : 
Audience: 
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker  :  
Vern Solberg
Company : 
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker  :  
Bill Hargin
Company : 
Z-zero
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,...
Speaker  :  
Paul Cooke
Company : 
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker  :  
Ata Syed
Company : 
PFC Flexible Circuits
Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers  Flex layer processing and stackup Polyimides...
Speaker  :  
Ata Syed
Company : 
PFC Flexible Circuits
The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits: What is flex? Why use flex? Who should know flex? When to use flex Where to use flex   Presenter Ata Syed is...
Speaker  :  
Doug Brooks and Dr. Johannes Adam
Stop thinking about current density! In this 30-minute video, Doug Brooks and Dr. Johannes Adam explain the material parameters and properties that determine the temperature of a trace, how these...
Speaker  :  
Zachariah Peterson
Company : 
Northwest Engineering Solutions
High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire...
Speaker  :  
Robert Carter
Company : 
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker  :  
Michael R. Creeden
Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal...
Speaker  :  
Atar Mittal
Company : 
Sierra Circuits
Signal degradation on PCB transmission lines manifests in many forms: undershoot, overshoot, ringing, pulse shape distortion, switching noise, attenuation, ground bounce, skew, etc. All these can be...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules...
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker  :  
Daniel J. Smith
Company : 
Raytheon SAS
Skill Level : 
Audience: 
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the...
Speaker  :  
Keven Coates,
Company : 
Geospace Technologies
What is a wire? At high speeds, it behaves very differently from what we were taught in college. This presentation on high-speed basics makes the subject intuitive in a way that’s easily understood....
Speaker  :  
Ralf Bruening
Company : 
Zuken
Supply voltages decrease with every new silicon generation, contributing as well to the goal of reducing power consumption of our electronics. Coupled with the resulting shrinking noise margins for...
Speaker  :  
Dan Beeker
Company : 
NXP Semiconductor
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and...
Speaker  :  
Keven Coates
Company : 
Geospace Technologies
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker  :  
Jamie Pacamarra
Company : 
Analog Devices
Skill Level : 
Audience: 
When signals start to get affected by the physical characteristics of the PCB, things start to get a little tricky. A simple point-to-point connection won’t be enough to keep the integrity of the...
Speaker  :  
John Coonrod
Company : 
Rogers Corp.
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how...
Speaker  :  
Eric Bogatin
Company : 
Teledyne LeCroy
A differential pair is any two transmission lines. When each transmission line has a return plane, its pretty clear how the differential impedance is related to the geometry. But what if there is no...
Speaker  :  
Bill Hargin
Company : 
Z-zero
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those...
Speaker  :  
Keven Coates
Company : 
Geospace Technologies
Have you ever had a noise-sensitive circuit and tried to find the noise source? Even after you completely encased sensitive portions in all sorts of shielding, you still had noise? It’s very...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
A step-by-step guideline for determining the PCB design requirements based on device energy consumption requirements. Wave cycle times and transmission line capacity form the basis of this...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
Speaker  :  
Eric Bogatin
Company : 
Teledyne LeCroy
Some experts say you should never use a split ground plane. Others say you should use a split ground plane to control noise. When is the right time to split a ground plane? We will explore the...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
Tired of failing EMC certification over and over? Join the crowd. Shrinking IC geometries and a resulting increase in switching speeds make designing compliant printed circuit boards more...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker  :  
Ata Syed
Company : 
PFC Flexible Circuits
Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers  Flex layer processing and stackup Polyimides...
Speaker  :  
Ata Syed
Company : 
PFC Flexible Circuits
The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits: What is flex? Why use flex? Who should know flex? When to use flex Where to use flex   Presenter Ata Syed is...
Speaker  :  
Robert Carter
Company : 
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker  :  
Michael R. Creeden
Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker  :  
Vern Solberg
Company : 
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker  :  
John Coonrod
Company : 
Rogers Corp.
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties...
Speaker  :  
Bill Hargin
Company : 
Z-zero
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,...
Speaker  :  
Paul Cooke
Company : 
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that...
Speaker  :  
Doug Brooks and Dr. Johannes Adam
Stop thinking about current density! In this 30-minute video, Doug Brooks and Dr. Johannes Adam explain the material parameters and properties that determine the temperature of a trace, how these...
Speaker  :  
Ata Syed
Company : 
PFC Flexible Circuits
The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits: What is flex? Why use flex? Who should know flex? When to use flex Where to use flex   Presenter Ata Syed is...
Speaker  :  
Ethan Pierce
Company : 
Pierce Design
Maintaining a product is very difficult when: The source files aren’t available Only Gerber files and maintenance documents are available Making a revision to a company-owned product with no...
Speaker  :  
Susy Webb
Company : 
Design Science
There is more to board design than placing parts and connecting the signals electrically. Those who design the board can make a huge impact on the ease of fabrication and assembly just by adhering...
Speaker  :  
Zachariah Peterson
Company : 
Northwest Engineering Solutions
High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire...
Speaker  :  
Robert Carter
Company : 
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker  :  
Michael R. Creeden
Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal...
Speaker  :  
Atar Mittal
Company : 
Sierra Circuits
Signal degradation on PCB transmission lines manifests in many forms: undershoot, overshoot, ringing, pulse shape distortion, switching noise, attenuation, ground bounce, skew, etc. All these can be...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules...
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker  :  
Daniel J. Smith
Company : 
Raytheon SAS
Skill Level : 
Audience: 
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the...
Speaker  :  
Keven Coates,
Company : 
Geospace Technologies
What is a wire? At high speeds, it behaves very differently from what we were taught in college. This presentation on high-speed basics makes the subject intuitive in a way that’s easily understood....
Speaker  :  
Ralf Bruening
Company : 
Zuken
Supply voltages decrease with every new silicon generation, contributing as well to the goal of reducing power consumption of our electronics. Coupled with the resulting shrinking noise margins for...
Speaker  :  
Dan Beeker
Company : 
NXP Semiconductor
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and...
Speaker  :  
Vern Solberg
Company : 
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker  :  
Susy Webb
Company : 
Design Science
Skill Level : 
Audience: 
When designing a PCB, the signal routing and its return are critical to the circuit working properly. Great care is usually given to routing the signals, but often the return portion is the last...
Speaker  :  
Keven Coates
Company : 
Geospace Technologies
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker  :  
Jamie Pacamarra
Company : 
Analog Devices
Skill Level : 
Audience: 
When signals start to get affected by the physical characteristics of the PCB, things start to get a little tricky. A simple point-to-point connection won’t be enough to keep the integrity of the...
Speaker  :  
John Coonrod
Company : 
Rogers Corp.
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how...
Speaker  :  
Eric Bogatin
Company : 
Teledyne LeCroy
A differential pair is any two transmission lines. When each transmission line has a return plane, its pretty clear how the differential impedance is related to the geometry. But what if there is no...
Speaker  :  
Elizabeth Bustamante
Company : 
SnapEDA
When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented...
Speaker  :  
Bill Hargin
Company : 
Z-zero
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those...
Speaker  :  
Keven Coates
Company : 
Geospace Technologies
Have you ever had a noise-sensitive circuit and tried to find the noise source? Even after you completely encased sensitive portions in all sorts of shielding, you still had noise? It’s very...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
A step-by-step guideline for determining the PCB design requirements based on device energy consumption requirements. Wave cycle times and transmission line capacity form the basis of this...
Speaker  :  
Susy Webb
Company : 
Design Science
Skill Level : 
Audience: 
There are many ways to route a PCB, some much more effective for signals than others. The first design rule is that the board must work properly, so it is important to have a plan that addresses...
Speaker  :  
Paul Cooke
Company : 
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
Speaker  :  
Eric Bogatin
Company : 
Teledyne LeCroy
Some experts say you should never use a split ground plane. Others say you should use a split ground plane to control noise. When is the right time to split a ground plane? We will explore the...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
Tired of failing EMC certification over and over? Join the crowd. Shrinking IC geometries and a resulting increase in switching speeds make designing compliant printed circuit boards more...
Speaker  :  
Phil Zarrow
Company : 
ITM Consulting
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker  :  
Michael Ford, and Hemant Shah
Company : 
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
Speaker  :  
Benjamin Jordan
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This...
Speaker  :  
Susy Webb
Company : 
Design Science
Skill Level : 
Audience: 
Technical sessions at conferences often emphasize the latest techniques and technologies, but those classes are often too in-depth for a novice designer, and don’t speak to the questions from the...
Speaker  :  
Ethan Pierce
Company : 
Pierce Design
Maintaining a product is very difficult when: The source files aren’t available Only Gerber files and maintenance documents are available Making a revision to a company-owned product with no...
Speaker  :  
Fumiyasu Ohbuchi
Company : 
Siemens
With an estimated 80,000 SMTP lines in use standards are a lifeline for line operators and equipment and software developers worldwide. SEMI is developing a suite of standards for SMT and PCBA...
Speaker  :  
Daniel J. Smith
Company : 
Raytheon SAS
Skill Level : 
Audience: 
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker  :  
John Coonrod
Company : 
Rogers Corp.
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The...
Speaker  :  
Paul Cooke
Company : 
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker  :  
Michael Ford, and Hemant Shah
Company : 
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...

Printed Circuit University offers Flexible, Affordable Electronics Education. We offer online classes from some the top professionals in their fields

Don't have an account yet? Register Now!

Sign in to your account