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Laminates

Speaker  :  
Robert Carter
Company : 
Oak-Mitsui Technologies

Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to accommodate higher speeds, and good Signal/Power Integrity. One solution to this emerging technological challenge is embedded capacitance technology.

Use of planar embedded capacitance will reduce overall inductance of the power distribution network as well as free up surface real estate by removing discrete capacitors. Ultra-thin laminates with high capacitance and Dk will also help reduce noise. Additionally, embedded capacitance technology offers better reliability due to having less components on the PCB surface.

The course will cover important aspects of utilizing embedded capacitance technology in order to enhance PCB design. Below is the course outline:

1. Improve Power Delivery, Signal Integrity and Reduce Noise with Embedded
– Robert Carter, Oak-Mitsui Technologies
2. Implementing Embedded Capacitance – CAD Tool Schematic and Layout
– Chris Carlson, Altium
3. Implementing Embedded Capacitance – How to Run Simulation
– Yoshi Fukawa, TechDream
4. Processing Embedded Capacitance Ulta-Thin Laminates
– Robert Carter, Oak-Mitsui Technologies
5. Characterization of Embedded Capacitance Material with Near Field Measurement
– Jin Min, Amber Precision Instruments)

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