This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
Technical sessions at conferences often emphasize the latest techniques and technologies, but those classes are often too in-depth for a novice designer, and don’t speak to the questions from the... [more]
The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits: What is flex? Why use flex? Who should know flex? When to use flex Where to use flex Presenter Ata Syed is... [more]