Next-Generation Materials: High-Speed, RF and HDI Designs

With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]

Power Delivery System Design

With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal... [more]

Designing and Analyzing High Frequency Interconnects

High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire... [more]

The New SEMI SMT-ELS Standards Suite for SMT and PCBA Lines

With an estimated 80,000 SMTP lines in use standards are a lifeline for line operators and equipment and software developers worldwide. SEMI is developing a suite of standards for SMT and PCBA... [more]