PFC Flexible Circuits
Materials of Flex Circuits: Specifications and Applications covers the following:
Coverlays, cores, bond plies, adhesives and their suppliers
Flex layer processing and stackup
PFC Flexible Circuits
The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits:
What is flex?
Why use flex?
Who should know flex?
When to use flex
Where to use flex
Presenter Ata Syed is...
Northwest Engineering Solutions
High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire...
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Michael R. Creeden
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,...
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
Some experts say you should never use a split ground plane. Others say you should use a split ground plane to control noise. When is the right time to split a ground plane? We will explore the...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Michael Ford, and Hemant Shah
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...