Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level packaging (FOWLP), JEDEC package outline standards. 2. Innovative solutions for 2D, 2.5D and 3D packaging, 2D BGA package technology, 3D multiple die and stacked package methodologies, implementing 2.5D for high-density BGA applications, silicon-based interposer structure, glass-based interposer structures, organic (laminate) based interposer structures. 3. Printed circuit board design guidelines for HDI, ball grid array (BGA), fine-pitch ball grid array (FBGA and DSBGA), flip-chip (WLP/FOWLP), 2.5D interposer structures; 4. HDI circuit and microvia design implementation, HDI circuit fabrication variations, microvia process methodology, design guidelines for HDI circuits, HDI sources and economic issues. 5. Specifying PCB base material, surface finish and coatings, organic-based material selection criteria, specifying thickness of copper foils, surface plating and coating variations, solder mask process considerations; 6. Preparation for high-volume assembly processing, surface mount assembly process overview, basic features needed for SMT assembly processing, system requirements for BGA and CSP device placement, palletizing to maximize assembly process efficiency, assembly process implementation.