PCB Problem Solving – PCB 102

This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Designing and Analyzing High Frequency Interconnects

High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire... [more]

PCB Design of Power Distribution and Decoupling

Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to... [more]