PC Board Grounding to Control Noise, EMI and Signal Integrity

When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and... [more]

Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold the Equations, Please!

The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how... [more]

IoT PC Board Design and Layout

Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]