Mechanical Design to Control EMI

As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those... [more]

Next-Generation Materials: High-Speed, RF and HDI Designs

With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]

PCB Stackup Design and Materials Selection

The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,... [more]

Differential Pair Routing for SI and EMI Control

Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules... [more]