This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is... [more]
Supply voltages decrease with every new silicon generation, contributing as well to the goal of reducing power consumption of our electronics. Coupled with the resulting shrinking noise margins for... [more]
Stop thinking about current density! In this 30-minute video, Doug Brooks and Dr. Johannes Adam explain the material parameters and properties that determine the temperature of a trace, how these... [more]