Manufacturing by Design is the New DfM

Today’s SMT and PTH assembly processes are driven by component packaging technology and functional design requirements. These requirements are driving manufacturing/test toward “build right” and... [more]

PCB Design of Power Distribution and Decoupling

Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Differential Pair Routing for SI and EMI Control

Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules... [more]