With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]
Engineered Reliability: Safeguarding Electrical Components and Devices with Nanocoating Technology, focuses on real-world examples of where significant product challenges were presented (such as... [more]
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,... [more]