This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed... [more]
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal... [more]
Signal degradation on PCB transmission lines manifests in many forms: undershoot, overshoot, ringing, pulse shape distortion, switching noise, attenuation, ground bounce, skew, etc. All these can be... [more]