Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to... [more]
As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that... [more]
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed... [more]