Today’s SMT and PTH assembly processes are driven by component packaging technology and functional design requirements. These requirements are driving manufacturing/test toward “build right” and... [more]
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal... [more]
High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire... [more]
When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and... [more]