Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The... [more]
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]
There are many ways to route a PCB, some much more effective for signals than others. The first design rule is that the board must work properly, so it is important to have a plan that addresses... [more]
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]