The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,... [more]
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This... [more]
Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers Flex layer processing and stackup Polyimides... [more]