RF and Mixed Signal PCB Layout

This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the... [more]

Next-Generation Materials: High-Speed, RF and HDI Designs

With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Feeding the Beast: Consumption-Based PCB Design

A step-by-step guideline for determining the PCB design requirements based on device energy consumption requirements. Wave cycle times and transmission line capacity form the basis of this... [more]