My Account | Cart Contents | Checkout   
Members please sign in or become a member for enhanced access to free site content.

BTS022 Signal Integrity and HDI

BTS022 Signal Integrity and HDI

By Eric Bogatin, originally published in Circuitree Magazine, June 1999
HDI technology, also known as micro via or buildup circuit boards, uses fine lines, thin dielectric layers and vias typically 5 mils in diameter that connect adjacent layers. Boards using this technology have a few performance advantages because of the small vias and short interconnects. In this feature article, we review the physical features of HDI substrates and the electrical performance that is possible.

Currently no reviews.
How to access this information...

To access all of the information below, please enter your email and password into the login form in the upper right corner of this page.
This feature is available only if you are logged in.This feature is available only if you are logged in.

 

 

 


SSL