This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is... [more]
Are your PCB buyers staying competitive in the face of COVID-19 restrictions, increased raw material and precious metal costs, rising freight prices, and a less competitive U.S. dollar? What is... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits: What is flex? Why use flex? Who should know flex? When to use flex Where to use flex Presenter Ata Syed is... [more]