PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

What Every Design Engineer Should Know About Design for SMT Manufacturability

This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is... [more]

Novel Power Distribution System Design

This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed... [more]

Reverse Engineering PCBs: How to Recreate a Lost Design

Maintaining a product is very difficult when: The source files aren’t available Only Gerber files and maintenance documents are available Making a revision to a company-owned product with no... [more]