PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Power Delivery System Design

With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal... [more]

Safeguarding Electrical Components and Devices with Nanocoating Technology

Engineered Reliability: Safeguarding Electrical Components and Devices with Nanocoating Technology, focuses on real-world examples of where significant product challenges were presented (such as... [more]

Designing and Analyzing High Frequency Interconnects

High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire... [more]