Via and Trace Currents and Temperatures

Stop thinking about current density! In this 30-minute video, Doug Brooks and Dr. Johannes Adam explain the material parameters and properties that determine the temperature of a trace, how these... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing

The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]

RF and Mixed Signal PCB Layout

This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the... [more]