Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.

Current Workshops

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...

With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...

Engineered Reliability: Safeguarding Electrical Components and Devices with Nanocoating Technology, focuses on real-world examples of where significant product challenges were presented (such as...

High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire...

Printed Circuit University offers Flexible, Affordable Electronics Education. We offer online classes from some the top professionals in their fields

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