The Butterfly Effect in PCB Design: Optimization of High-speed Lines for an FMC Carrier Board

When signals start to get affected by the physical characteristics of the PCB, things start to get a little tricky. A simple point-to-point connection won’t be enough to keep the integrity of the... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Power Delivery System Design

With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal... [more]

Reverse Engineering PCBs: How to Recreate a Lost Design

Maintaining a product is very difficult when: The source files aren’t available Only Gerber files and maintenance documents are available Making a revision to a company-owned product with no... [more]