With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]
Are your PCB buyers staying competitive in the face of COVID-19 restrictions, increased raw material and precious metal costs, rising freight prices, and a less competitive U.S. dollar? What is... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how... [more]