Differential Pair Routing for SI and EMI Control

Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules... [more]

The New SEMI SMT-ELS Standards Suite for SMT and PCBA Lines

With an estimated 80,000 SMTP lines in use standards are a lifeline for line operators and equipment and software developers worldwide. SEMI is developing a suite of standards for SMT and PCBA... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

The Basics of PCB Design

Technical sessions at conferences often emphasize the latest techniques and technologies, but those classes are often too in-depth for a novice designer, and don’t speak to the questions from the... [more]