Hair-Raising Footprint Horror Stories – and How to Avoid Them

When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented... [more]

Novel Power Distribution System Design

This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

PCB Design of Power Distribution and Decoupling

Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to... [more]